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Lead ASIC Design Engineer

Chelmsford, MA

Position Information

 Position ID: 2353D

 Job Category: Engineering

 Type: Full Time, Employee

The Photonics Group
Respond with resume to dab@mri-rtp.com

Description:
Fortune 500 Company is looking for an Electrical Engineer with a strong background in ASIC design to lead electronic design efforts of a cross-functional team in the development of a revolutionay family of products for diabetes care in a start-up environment. The ideal candidate will have been the lead designer on both multi-chip products as well as system on a chip ASICs. 

Responsibilities:
*  Integrate analog and programmable digital functionality, to drive the overall architecture and signal path design for a low-powered portable system with a body worn biosensor. 
*  Work with the product development team to generate requirements, plan the project, participate in the medical device risk analysis and qualify the system for release.
*  Prepare and maintain formal documentation, insure compliance to strict design and release policies and procedures. 
*  Drive technical design reviews and interfaces with other functional areas, marketing, systems, hardware, etc to ensure successful implementation of intended designs.

Requirements:
*  Hands on experience designing commercial products with Verilog or VHDL. 
*  Demonstrated design ability for low noise sensor interfacing and analog processing for very low powered remote controlled sensors. 
*  Experience developing portable electronic systems for medical device deployment with low powered implantable devices. 
*  Experience with the development of electronic control systems and algorithms (COMSOL, MatLab), system simulation and low power validation under Cadence design environments and device simulation (SPICE, SILVACO). 
*  Design experience with elements that include RF, very low standby power management and integrated photonic devices using Virtuoso
*  Experience with standards including medical quality (FDA21CFR820, IEC60601/60825 IEEE 802.15/11073). 
*  Board level design with ORCAD/PADS and advanced packaging as well as IC foundry process simulations (SUPREM).
*  Experience with project planning, requirement generation directly from marketing & system specifications, device verification, IC process development, packaging, PC board design and yield optimization.   

*  10-12 years of relevant experience

* MS Electrical Engineering required, PhD Electrical Engineering preferred
*  Proven deployment of ASIC based designs with embedded memory and digital RF
*  Experience with SOC design tools (Cadence, Silvaco) with integrated DFT or boundary scan
*  Process development with commerical foundries, external packaging and test facilities to develop commercially successful IC products
*  Experience working in a medical quality environment preferred
*  Foundry interface and lead design interface with 3rd party design and IP core providers preferred

*  Implementation of ASIC SOC integration including custom devices preferred

The Photonics Group
919 479 1941

 

 

Contact Information

 Company: MRINetwork


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