SENIOR TECHNOLOGY PACKAGING TECHNOLOGY ENGINEER #1231824
Lead next generation 28nm Lead Free bump and assembly technology development with our foundry and subcon partners. The engineer will be responsible for defining process flow, material set, design rules and fab/bump/assembly process controls needed to successfully develop a manufacturable and reliable Lead Free product.
MINIMUM REQUIREMENTS:
- Phd - Materials Science, Mechanical Engineering, Physics.
- 5+ Years in technology development.
- Expert in Bump/Packaging/Assembly.
- Must have experience in Lead Free FC Development & Chip-Package Interaction.
- Materials expertise in bump material, substrates, and UF.
EOE
Interested in talking with us? Please apply directly at NVIDIA.COM
- Company:
Nvidia - Location:
Santa Clara, CA - Industries:
Electronics, Components, and Semiconductor Mfg
Computer Hardware
Computer Software - Job Type:
Full Time
Employee - Career Level:
Experienced (Non-Manager) - Job Reference Code:
1231824
PACKAGING ENGINEER
NVIDIA is the world leader in graphics processing technologies, creating innovative, industry-changing products for computing, consumer electronics, and mobile devices. NVIDIA products are transforming visually-rich applications such as video games, film production, broadcasting, industrial design, space exploration, and medical imaging. We invest in our people and our technologies, support and fund industry research around the world, and consistently deliver high-quality products. NVIDIA's culture promotes and inspires a team of world-class employees to be at the top of their game. We've created an environment where talents are recognized and collaboration is valued. Our employees are shaping the world of tomorrow. . . today. We invite you to explore the opportunities available at NVIDIA to see what your future may hold.
